Sometime
in the third week of August, iNEMI released an announcement via Solid State
Technology, that it is starting a new convergence project on semiconductor
packaging equipment requirements, and is seeking input from the industry.
According
to iNEMI, semiconductor packaging, equipment and manufacturing complexity have
risen dramatically in the past decade. Integrated Circuit makers have increased
their specific equipment requirements, but have not developed a consistent set
of industry-wide requirements for precompetitive needs. The resultant
“semi-custom” equipment set ups can increase cost and lead to integration or
quality issues upon installation. Semi-custom packaging equipment cannot
consistently meet common industry needs.
This
is where BestPack
comes in with an edge over competitors. BestPack offers custom made taping machines or packaging equipment and automation
systems for its clients because packaging needs vary from one industry to
another. Automatic taping machines or packaging equipment are great tools to
optimize operational efficiency and reduce production costs. In addition to over
ninety (90) models of both fully automated taping or packaging machines and
manual taping or packaging machines to choose from that BestPack offers, the
company is known for its engineering innovations and customization ability.
The
objective of iNEMI’s project is to align Integrated Circuit maker and equipment
supplier requirements and drive industry convergence in the following areas:
· Equipment software automation
· Equipment electro-static discharge
(ESD) capabilities and test methods
· Material handling systems (MHS)
capabilities and test methods
· Conservation efforts to reduce
consumption (e.g., power, water, gas, etc.) and emissions (e.g., waste water,
gas, etc.)
The
project aims to develop a common set of requirements and targets that can be
universally understood in the semiconductor packaging industry. It will also seek
to define instrumentation specifications and methods to validate equipment
requirements, and classify which types of packaging assembly equipment require
which standards.
The
International Electronics Manufacturing Initiative (iNEMI) is a not-for-profit,
highly efficient R&D consortium of approximately one hundred (100) leading
electronics manufacturers, suppliers, associations, government agencies and
universities. iNEMI roadmaps the future technology requirements of the global
electronics industry, identifies and prioritizes technology and infrastructure
gaps, and helps eliminate those gaps through timely, high-impact deployment
projects.
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