Friday, August 31, 2012

BestPack Taping Machines: Answering The Call Of Customization

Sometime in the third week of August, iNEMI released an announcement via Solid State Technology, that it is starting a new convergence project on semiconductor packaging equipment requirements, and is seeking input from the industry.

According to iNEMI, semiconductor packaging, equipment and manufacturing complexity have risen dramatically in the past decade. Integrated Circuit makers have increased their specific equipment requirements, but have not developed a consistent set of industry-wide requirements for precompetitive needs. The resultant “semi-custom” equipment set ups can increase cost and lead to integration or quality issues upon installation. Semi-custom packaging equipment cannot consistently meet common industry needs.

This is where BestPack comes in with an edge over competitors. BestPack offers custom made taping machines or packaging equipment and automation systems for its clients because packaging needs vary from one industry to another. Automatic taping machines or packaging equipment are great tools to optimize operational efficiency and reduce production costs. In addition to over ninety (90) models of both fully automated taping or packaging machines and manual taping or packaging machines to choose from that BestPack offers, the company is known for its engineering innovations and customization ability.

The objective of iNEMI’s project is to align Integrated Circuit maker and equipment supplier requirements and drive industry convergence in the following areas:

·      Equipment software automation
·      Equipment electro-static discharge (ESD) capabilities and test methods
·      Material handling systems (MHS) capabilities and test methods
·    Conservation efforts to reduce consumption (e.g., power, water, gas, etc.) and emissions (e.g., waste water, gas, etc.)

The project aims to develop a common set of requirements and targets that can be universally understood in the semiconductor packaging industry. It will also seek to define instrumentation specifications and methods to validate equipment requirements, and classify which types of packaging assembly equipment require which standards.

The International Electronics Manufacturing Initiative (iNEMI) is a not-for-profit, highly efficient R&D consortium of approximately one hundred (100) leading electronics manufacturers, suppliers, associations, government agencies and universities. iNEMI roadmaps the future technology requirements of the global electronics industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact deployment projects.

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